pk137 (v1.3) july 20, 2010 www.xilinx.com 1 ?2006? 2010 xilinx, inc. xilinx, the xilinx logo, virtex, spartan, ise, and other designated brands included herein are tradema rks of xilinx in the united states and other countries. all other trademarks are the property of their respective owners. average weight: 14.0g pk137 (v1.3) july 20, 2010 100% material declaration data sheet FF1152 component substance description cas number or description percentage of component use in product component weight/ substance weight (grams) component percent of total silicon die 0.8848 6.32 silicon 7440-21-3 100.00 0.8848 solder bump 0.0154 0.11 tin 7440-31-5 63.00 0.009702 lead 7439-92-1 37.00 0.005698 underfill 0.112 0.80 silica 60676-86-0 70.00 0.0784 epoxy resin a 9003-36-5 20.00 0.0224 epoxy resin b 25068-38-6 3.00 0.00336 hardener 19900-65-3 7.00 0.00784 heat sink 8.3258 59.47 copper 7440-50-8 99.97 8.32330226 nickel 7440-02-0 0.03 0.00249774 heat sink adhesive 0.0007 0.05 organopolysiloxane mixture na 100.00 0.0007 substrate 3.7156 26.54 copper 7440-50-8 47.61 metal layer 1.76899716 nickel 7440-02-0 0.51 metal layer 0.01894956 gold 7440-57-5 0.11 metal layer 0.00408716 glass fiber n/a 10.35 0.3845646 bt (core) n/a 27.54 1.02327624 halogen fire retardant n/a 5.25 0.195069 solder mask n/a 8.63 0.32065628 solder balls 0.9394 6.71 tin 7440-31-5 63.00 0.591822 lead 7439-92-1 37.00 0.347578
100% material declaration data sheet FF1152 pk137 (v1.3) july 20, 2010 www.xilinx.com 2 revision history the following table shows the revision history for this document. notice of disclaimer xilinx regards this materials data to be correct but makes no guarantee as to its accuracy or completeness, including, but not limited to, with respect to its compliance with applicable environmental laws and regulations. xilinx subcontracts the produ ction, test and assembly of hardware devices to independent third-party vendors and materials supplie rs (?contractors?). all data provided hereunder is based on information received from contractors. xili nx has not independently verified the accuracy or completeness of this information which is provided so lely for your reference in connection with the use of xilinx products. date version description of revisions 3/23/06 1.0 initial xilinx release. 7/13/06 1.1 100% material declaration. 9/28/06 1.2 updated component descriptions. 7/20/10 1.3 updated heat sink substance description.
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